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Bond Test and Resonance Applications for MIZ-21SR and S-21R
Two bond testing techniques double your power to detect disbonds and delaminations between layers
Modern aircrafts make extensive use of composite materials - from structural panels and control surfaces to helicopter rotor blades and propellers. Delaminations within these materials jeopardize their structural integrity.
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The MIZ-21SR Multimode Tester and S-21R Bond Tester offer two important Non-Destructive Inspection (NDI) techniques for detecting disbonds and delaminations in multi-layered composite structures.
Together, the resonance and sondicator techniques double your bond testing capabilities.
Use the pitch-catch (sondicator) technique to ensure quality of bonded repairs and evaluate impact or structural damage. Reliably detect disbonds in honeycomb structures, face-sheet disbonding, and delamination from the honeycomb structure.
Switch to the resonance mode to pinpoint which plies are unbonded in multilayer laminate structures.
Depending on the application, either technique can be used to inspect metal-to-metal bonded structures.
The Sondicator Mode: Finding a metal-to-metal disbond.
You can use the XY (Flying Dot) or YT display for sondicator testing. This example shows the XY mode. During the inspection, you can freeze the Phase/Amplitude display with the HOLD function. Use the BUFFER to review any signal obtained in the last 8 seconds. By expanding or contracting the Data Cursor window within the data buffer, you can isolate specific signals for in-depth evaluation.
The Resonance Mode: Locating the ply with the disbond.
Disbonds are easy to locate using the resonance test mode of the S-21R or MIZ-21SR. Start by calibrating the tester on a composite step block or standard of known thickness. Plot up to ten calibration reference points to represent various thicknesses. Adjust the display for your requirements using screen scaling V/H, rotation, and position. Then place the transducer on the test material and observe where the signal stabilizes. Correlate the test signal's position to one of the plotted points to determine thickness.
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